Laird Thermal Materials A10222-02

Material

Boron Nitride Filled

Shape

Square

RoHS

Details

Factory Pack QuantityFactory Pack Quantity

6

Tradename

Tpli

Package

Bulk

Mfr

Laird Technologies - Thermal Materials

Product Status

Active

Series

Tpli 200

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Type

Gap Filler Pad, Sheet

Color

-

Usage

-

Shelf Life

24 Months

Adhesive

Adhesive - One Side

Storage/Refrigeration Temperature

-

Shelf Life Start

Date of Shipment

Backing, Carrier

-

Outline

203.20mm x 203.20mm

Thermal Conductivity

a measure of a material's ability to?conduct heat.?

6.0W/m-K

Product

Thermally Conductive Gap Pad

Thermal Resistivity

Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance.

-

Thickness

0.0390 (0.991mm)