XPC100A001-01-B

Lantronix, Inc. XPC100A001-01-B

Part No:

XPC100A001-01-B

Manufacturer:

Lantronix, Inc.

Package:

Module

ROHS:

AINNX NO:

863775-XPC100A001-01-B

Description:

XPICO DEVICE SERVER MODULE MOUNT

Products specifications
  • Factory Lead Time
    6 Weeks
  • Package / Case
    Module
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Series
    xPico®
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    Not Applicable
  • Accessory Type
    Mount
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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