Lite-On GBJ25V08

Mounting Type

Surface Mount

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Diode Element Material

SILICON

Number of Terminals

4

Manufacturer

LITE-ON SEMICONDUCTOR CORP.

RoHS

Y

Lifetime @ Temp.

-55°C to +150°C

Package Description

R-PSFM-T4

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Operating Temperature-Max

150 °C

Rohs Code

Yes

Manufacturer Part Number

GBJ25V08

Package Shape

RECTANGULAR

Number of Elements

4

Part Life Cycle Code

Active

Ihs Manufacturer

LITE-ON SEMICONDUCTOR CORP

Risk Rank

5.77

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Weight: 6.82 grams (Approximate)

Size / Dimension

29.70mm L x 4.40mm W (min.)

ECCN Code

EAR99

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

UL RECOGNIZED

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

R-PSFM-T4

Configuration

BRIDGE, 4 ELEMENTS

Voltage

600V

Diode Type

BRIDGE RECTIFIER DIODE

Output Current-Max

4.8 A

Number of Phases

1

Rep Pk Reverse Voltage-Max

800 V

Non-rep Pk Forward Current-Max

480 A

Breakdown Voltage-Min

800 V

Height Seated (Max)

36.70mm