MACOM Technology Solutions MAAP-011106-DIE

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Factory Pack QuantityFactory Pack Quantity

25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

Yes

Operating Frequency (Max)

86000 MHz

Manufacturer Part Number

MAAP-011106-DIE

Part Life Cycle Code

Active

Ihs Manufacturer

M/A-COM TECHNOLOGY SOLUTIONS INC

Risk Rank

5.69

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Waffle

Construction

COMPONENT

Reach Compliance Code

compliant

Gain

18 dB

RF/Microwave Device Type

WIDE BAND MEDIUM POWER

Operating Frequency-Min

71000 MHz

Input Power-Max (CW)

16 dBm

Characteristic Impedance

50 Ω