MACOM Technology Solutions MAPDCC0002TR

Package / Case

8-SOIC (0.154", 3.90mm Width)

Mfr

MACOM Technology Solutions

Product Status

Active

Base Product Number

MAPDCC0002

Factory Pack QuantityFactory Pack Quantity

1000

Manufacturer

MACOM

Brand

MACOM

RoHS

Details

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

Yes

Operating Frequency (Max)

1990 MHz

Manufacturer Part Number

MAPDCC0002TR

Insertion Loss-Max

0.6 dB

Part Life Cycle Code

Active

Ihs Manufacturer

M/A-COM TECHNOLOGY SOLUTIONS INC

Risk Rank

5.26

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Size / Dimension

0.193" L x 0.154" W x 0.069" H (4.90mm x 3.90mm x 1.75mm)

JESD-609 Code

e3

Pbfree Code

Yes

Terminal Finish

Matte Tin (Sn)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY, ISOLATION-MIN (DB):15

Subcategory

Filters

Construction

MODULE

Reach Compliance Code

compliant

Frequency

1.85 GHz ~ 1.99 GHz

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Signal Conditioning

Specifications

a measure of a material's ability to?conduct heat.?

Isolation (Min) 15dB, 1.6 VSWR (Max), 3° Imbalance (Max)

RF/Microwave Device Type

SPLITTER

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

0.6dB

Operating Frequency-Min

1850 MHz

VSWR-Max

1.6

Input Power-Max (CW)

44.77 dBm

Characteristic Impedance

50 Ω

Product

Power Dividers

Product Category

a particular group of related products.

Signal Conditioning