M/A-Com Technology Solutions MIR50R-SR3AKNAG0T

Package / Case

0202 (0505 Metric)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

MIR

Size / Dimension

0.020Lx0.020W 0.50mmx0.50mm

Tolerance

±10%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±150ppm/°C

Resistance

5kOhm

Composition

Thick Film

Features

RF, High Frequency

Height Seated (Max)

0.010 0.26mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant