MBQ50T65FDSCTH

MagnaChip MBQ50T65FDSCTH

Part No:

MBQ50T65FDSCTH

Manufacturer:

MagnaChip

Datasheet:

-

Package:

-

AINNX NO:

31958307-MBQ50T65FDSCTH

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    Unknown
  • PPAP
    Unknown
  • Maximum Gate Emitter Voltage (V)
    ±20
  • Maximum Collector-Emitter Voltage (V)
    650
  • Typical Collector Emitter Saturation Voltage (V)
    1.95
  • Maximum Continuous Collector Current (A)
    100
  • Maximum Gate Emitter Leakage Current (uA)
    0.1
  • Maximum Power Dissipation (mW)
    273
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    175
  • Mounting
    Through Hole
  • Package Height
    21.46(Max)
  • Package Width
    5.31(Max)
  • Package Length
    16.26(Max)
  • PCB changed
    3
  • Tab
    Tab
  • Standard Package Name
    TO-247
  • Supplier Package
    TO-247
  • Lead Shape
    Through Hole
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Unconfirmed
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • Configuration
    Single
  • Channel Type
    N
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