MAX16507GGN+T
QFN-56
44134797-MAX16507GGN+T
Power Management Specialized - PMIC VR13 CPU Master
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.