Maxim Integrated DS9072-40V/NO-BRAND

Mount

Through Hole

Mounting Type

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

DS9072

Published

2007

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

Number of Positions

40

Number of Rows

1

Gender

Female

Pitch

1.27mm

Orientation

Straight

Contact Finish

Tin

Connector Style

SIMM

Features

Board Guide, Latches

Contact Finish Thickness

200.0μin 5.08μm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant