MAX1271BENG+
DIP
6941447-MAX1271BENG+
IC DAS/ADC 12BIT 110K 24DIP
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.
The center distance from one pole to the next.
a count of all of the component leads (or pins)
An indicator of formal certification of qualifications.
The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.
an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
often described in the context of signal processing as the number of samples per time.
the number of conversions divided by the total number of visitors.
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.