MaxLinear KH563AI

EU RoHS

Supplier Unconfirmed

ECCN (US)

EAR99

HTS

8542.33.00.01

Automotive

No

PPAP

No

Manufacturer Type

Wideband Amplifier

Number of Channels per Chip

1

Process Technology

Hybrid

Maximum Input Offset Voltage (mV)

5@±15V

Minimum Dual Supply Voltage (V)

±10

Typical Dual Supply Voltage (V)

±12

Maximum Dual Supply Voltage (V)

±15

Maximum Input Bias Current (uA)

20@±15V

Maximum Supply Current (mA)

60@±15V

Typical Output Current (mA)

210@±15V

Typical Slew Rate (V/us)

3300@±15V

Typical Input Noise Voltage Density (nV/rtHz)

2.1@±15V

Typical Voltage Gain (dB)

80(Max)

Typical Inverting Input Current Noise Density (pA/rtHz)

34@±15V

Typical Noninverting Input Current Noise Density (pA/rtHz)

2.8@±15V

Minimum PSRR (dB)

54

Typical Settling Time (ns)

7

Shut Down Support

No

Minimum Operating Temperature (°C)

-25

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Mounting

Through Hole

Package Height

3.81(Max)

Package Width

15.24

Package Length

32.77(Max)

PCB changed

24

Standard Package Name

DIP

Supplier Package

CDIP

Lead Shape

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Foam

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Wideband Amplifier

Pin Count

a count of all of the component leads (or pins)

24

Power Supply Type

There are three major kinds of power supplies: unregulated (also called brute force), linear regulated, and switching. The fourth type of power supply circuit called the ripple-regulated, is a hybrid between the “brute force” and “switching” designs, and merits a subsection to itself.

Dual