Micron MT9M111I29STC

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Mounting Feature

a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

SURFACE MOUNT

Package Description

BGA-44

Package Shape/Style

SQUARE

Operating Temperature-Min

-30 °C

Supply Voltage-Min

2.5 V

Operating Temperature-Max

70 °C

Rohs Code

No

Manufacturer Part Number

MT9M111I29STC

Horizontal Pixel

1280

Manufacturer

Micron Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Supply Voltage-Max

3.1 V

Risk Rank

8.78

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

JESD-609 Code

e0

Terminal Finish

Tin/Lead/Silver (Sn/Pb/Ag)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ELECTRONIC ROLLING SHUTTER

Subcategory

CCD Image Sensors

Reach Compliance Code

unknown

Body Length or Diameter

8.3 mm

Body Breadth

8.3 mm

Output Type

DIGITAL VOLTAGE

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

2.8 V

Termination Type

SOLDER

Sensors/Transducers Type

IMAGE SENSOR,CMOS

Housing

PLASTIC

Output Range

1.70-3.60V

Output Interface Type

2-WIRE INTERFACE

Pixel Size

the horizontal and vertical measurements of an image expressed in pixels.

3.60X3.60 µm

Dynamic Range

71 dB

Optical Format

1/3 inch

Master Clock

54 MHz

Frame Rate

15 fps

Vertical Pixel

1024

Array Type

FRAME TRANSFER

Body Height

1.17 mm

Lead Free

Contains Lead