PF38F5070M0Y0V0

Micron Technology Inc PF38F5070M0Y0V0

Part No:

PF38F5070M0Y0V0

Datasheet:

Package:

-

AINNX NO:

69093784-PF38F5070M0Y0V0

Category:

Specialized

Description:

Memory Circuit, Flash+PSRAM, PBGA165,

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    165
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    MICRON TECHNOLOGY INC
  • Package Description
    FBGA, BGA165,12X15,25
  • Access Time-Max
    96 ns
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    FBGA
  • Package Equivalence Code
    BGA165,12X15,25
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • ECCN Code
    EAR99
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.71
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Terminal Pitch

    The center distance from one pole to the next.

    0.635 mm
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    R-PBGA-B165
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Standby Current-Max
    0.00016 A
  • Memory IC Type
    MEMORY CIRCUIT
  • Mixed Memory Type
    FLASH+PSRAM
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