EX128-CSG128I

Microsemi Actel EX128-CSG128I

Part No:

EX128-CSG128I

Manufacturer:

Microsemi Actel

Datasheet:

-

Package:

2-SMD, J-Lead

AINNX NO:

40385823-EX128-CSG128I

Description:

FPGA 256 Clbs 6000 Gates PBGA128

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    2-SMD, J-Lead
  • Supplier Device Package
    SMD
  • Thermal Resistance of Package
    125°C/W
  • Lead Free Status / RoHS Status
    --
  • CCT(K)
    3500K
  • RoHS
    Non-Compliant
  • Series
    DURIS® E 3
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Size / Dimension
    0.118 L x 0.055 W (3.00mm x 1.40mm)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    --
  • Color
    White, Warm
  • Voltage - Forward (Vf) (Typ)
    3.05V
  • Viewing Angle

    the angle at which a display can be viewed with acceptable visual performance.

    110°
  • Current - Test
    20mA
  • Lumens/Watt @ Current - Test
    115 lm/W
  • CRI (Color Rendering Index)
    80
  • Current - Max
    30mA
  • Flux @ 25°C, Current - Test
    7 lm (6 lm ~ 8 lm)
  • Flux @ 85°C, Current - Test
    --
  • Height Seated (Max)
    0.051 (1.30mm)
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