SG55464Y

Microsemi Corporation SG55464Y

Part No:

SG55464Y

Datasheet:

Package:

-

AINNX NO:

69171482-SG55464Y

Description:

Peripheral Driver, 2 Driver, BIPolar, CDIP8, DIP-8

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Terminals
    8
  • Rohs Code
    No
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    MICROSEMI CORP
  • Package Description
    DIP, DIP8,.3
  • Operating Temperature-Max
    125 °C
  • Operating Temperature-Min
    -55 °C
  • Package Body Material
    CERAMIC
  • Package Code
    DIP
  • Package Equivalence Code
    DIP8,.3
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE
  • Supply Voltage-Nom
    5 V
  • JESD-609 Code
    e0
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54 mm
  • Reach Compliance Code
    not_compliant
  • JESD-30 Code
    R-XDIP-T8
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    MILITARY
  • Output Current-Max
    0.3 A
  • Driver Number of Bits
    2
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