Microsemi Corporation UXM15P

Lifecycle Status

IN PRODUCTION (Last Updated: 1 month ago)

Factory Lead Time

31 Weeks

Mounting Type

Surface Mount

Package / Case

24-VFQFN Exposed Pad

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Operating Temperature (Max.)

85°C

Operating Temperature (Min.)

-40°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

24

Terminal Finish

Matte Tin (Sn)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

FOR 20 GIGA HZ DIVISION RATIO IS 2/4/8; FOR 15 GIGA HZ DIVISION RATIO IS 4/5/6/7/8/9

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Supply Voltage

3.3V

Terminal Pitch

The center distance from one pole to the next.

0.5mm

Frequency

0Hz~15GHz

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

S-XQCC-N24

Function

Prescaler

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Family

UXM

Output Polarity

COMPLEMENTARY

Number of Data/Clock Inputs

1

Length

4mm

Width

4mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant