MikroElektronika MIKROE-4003

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Size / Dimension

35.00mm L x 20.00mm W

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Frequency

13.56MHz

Features

Near Field Communications (NFC)