Mill-Max Manufacturing Corp. 823-22-018-10-002101

Mount

Through Hole

Mounting Type

Through Hole

Material

Copper Alloy

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

823

Published

2007

JESD-609 Code

e4

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Connector Type

Piston

Number of Rows

2

Pitch

0.100 2.54mm

Contact Finish

Gold

Lead Pitch

2.54mm

Number of Contacts

18

Housing Color

Black

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

0.100 (2.54mm)

Height

5mm

Length

22.9mm

Width

5.08mm

Contact Finish Thickness

20.0μin 0.51μm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Flammability Rating

UL94 V-0

Lead Free

Lead Free