Mill-Max Manufacturing Corp. 829-22-007-20-001101

Factory Lead Time

3 Weeks

Mount

Through Hole

Mounting Type

Through Hole, Right Angle

Package / Case

SIP

Material

Copper Alloy

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Series

829

Published

2015

JESD-609 Code

e4

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Through Hole

Connector Type

Piston

Number of Rows

1

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Filter Feature

NO

Mixed Contacts

NO

Option

GENERAL PURPOSE

Pitch

0.100 2.54mm

Contact Finish

Gold

Number of Contacts

7

Contact Gender

Male

UL Flammability Code

94V-0

Contact Finish Thickness

20.0μin 0.51μm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant