Mill-Max Manufacturing Corp. 830-10-050-10-001000

Factory Lead Time

3 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Contact Shape

Circular

Housing Material

Nylon

Contact Finish Mating

Gold

Contact Length-Mating

0.154 3.91mm

Contact Materials

Brass Alloy

Insulation Materials

Polyamide (PA46), Nylon 4/6

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

830

Published

2005

JESD-609 Code

e4

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

Connector Type

Header

Number of Positions

50

Number of Rows

1

Gender

Male

Fastening Type

There are 5 Main Types of Fastening Type: Screws, Nails, Bolts, Anchors, Rivets.

Push-Pull

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Filter Feature

NO

Contact Type

Male Pin

Mixed Contacts

NO

Option

GENERAL PURPOSE

Orientation

Straight

Depth

2mm

Insulation Height

0.110 2.79mm

Style

Board to Board

Number of Positions Loaded

All

Pitch - Mating

0.079 2.00mm

Contact Length - Post

0.164 4.17mm

Shrouding

Unshrouded

Lead Pitch

2mm

Housing Color

Black

Overall Contact Length

0.475 12.07mm

Max Voltage Rating (AC)

100V

Length

100mm

Contact Finish Thickness - Mating

10.0μin 0.25μm

Contact Finish Thickness - Post

10.0μin 0.25μm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant