205090-1

Molex 205090-1

Part No:

205090-1

Manufacturer:

Molex

Datasheet:

-

Package:

8-TSSOP (0.173, 4.40mm Width)

AINNX NO:

33859054-205090-1

Description:

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    8-TSSOP (0.173, 4.40mm Width)
  • Supplier Device Package
    8-TSSOP
  • Current - Continuous Drain (Id) @ 25℃
    4.3A
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 150°C (TJ)
  • Series
    TrenchFET®
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Power - Max
    830mW
  • FET Type
    2 P-Channel (Dual)
  • Rds On (Max) @ Id, Vgs
    27 mOhm @ 5.1A, 4.5V
  • Vgs(th) (Max) @ Id
    450mV @ 5mA (Min)
  • Input Capacitance (Ciss) (Max) @ Vds
    --
  • Gate Charge (Qg) (Max) @ Vgs
    30nC @ 4.5V
  • Drain to Source Voltage (Vdss)
    12V
  • FET Feature
    Logic Level Gate
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