All Products
.png)
MoSys, Inc. MSR630AGE-2512
MSR630AGE-2512
676-BGA
69647047-MSR630AGE-2512
IC SRAM 1GBIT PAR 676BGA
- Package / Case676-BGA
- Supplier Device Package676-BGA (27x27)
- MfrMoSys, Inc.
- Base Product NumberMSR630
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Obsolete - Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
1Gbit - Clock Frequency1.25 GHz
- Memory FormatSRAM
- Memory Interface
An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.
Parallel - Memory Organization16M x 72
MC803128K32L-7R5I
MoSys IncCache SRAM, 128KX32, 4.5ns, CMOS, PQFP100, 20 X 14 MM, 0.65 MM PITCH, LQFP-100MSR630AGC-2512
MoSys, Inc.IC SRAM 1GBIT PAR 676BGAMSR622BJE288-10
MoSys, Inc.IC SRAM 576MBIT PAR 288FCBGAMSR622BJE288-12
MoSys, Inc.IC SRAM 576MBIT PAR 288FCBGAMSR820AJE288-10
MoSys, Inc.IC SRAM 576MBIT PAR 288FCBGAMSR820BJE288-12
MoSys, Inc.IC SRAM 576MBIT PAR 288FCBGAMSR830AGC-2512
MoSys, Inc.IC SRAM 1GBIT PAR 2512FCBGAMSR622AJE288-12
MoSys, Inc.IC SRAM 576MBIT PAR 288FCBGAMSR622BJC288-12
MoSys, Inc.IC SRAM 576MBIT PAR 288FCBGA
MSQ220AJC288-10
MoSys, Inc.IC RAM 512MBIT PARALLEL 288FCBGA