MSR830AGC-1512

MoSys, Inc. MSR830AGC-1512

Part No:

MSR830AGC-1512

Manufacturer:

MoSys, Inc.

Datasheet:

BE3-RMW w/RLT

Package:

676-BGA

ROHS:

AINNX NO:

1730439-MSR830AGC-1512

Category:

Memory

Description:

MOSYS BANDWIDTH ENGINE 3 - RMW

Products specifications
  • Factory Lead Time
    4 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    676-BGA
  • Memory Types
    Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C~85°C TC
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Voltage - Supply
    1V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    1.152Gb 16M x 72
  • Clock Frequency
    1.25GHz
  • Access Time
    2.7ns
  • Memory Format
    SRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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