Multicomp 26-2050

Product Depth (mm)

Not Required(mm)

DF

31%

Operating Temp Range

-55C to 125C

Case Style

Metal

Product Diameter (mm)

10.31(mm)

Mounting Styles

Through Hole

Length W/Weld

37.33(mm)

Lead Diameter (nom)

0.64(mm)

Tolerance (+ or -)

10%

DCL

8(uA)

Seal

Hermetic

Rad Hardened

No

Equivalent Series Resistance Type

STANDARD

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Capacitance

300000000PF(pF)

Construction

Axial

Termination Style

Axial

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

R

Polarity

Polar

Voltage

30VDC

Ripple Current

the pulsed current consumption of non-linear devices like capacitor-input rectifiers.

1950(mA)

Insulation

Sleeved

Product Length (mm)

28.6(mm)

Product Height (mm)

Not Required(mm)