Murata DMS-20PC-1-OS

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Factory Pack QuantityFactory Pack Quantity

900

Mounting Styles

-

Contact Materials

Phosphor Bronze

Manufacturer

TE Connectivity

Brand

TE Connectivity / AMP

RoHS

Details

Series

HPI

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Type

Shrouded

Number of Positions

11 Position

Applications

Wire-to-Board

Number of Rows

1 Row

Subcategory

Headers & Wire Housings

Pitch

2 mm

Termination Style

Solder

Contact Gender

Pin (Male)

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Headers & Wire Housings

Product

Headers

Product Category

a particular group of related products.

Headers & Wire Housings