Murata Power Solutions Inc. DMS-BZL1-C

Factory Lead Time

10 Weeks

Weight

8.000009g

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

DMS-BZL

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Accessory Type

Bezel

Includes

Bezel, Hardware

Specifications

a measure of a material's ability to?conduct heat.?

Rectangular 64.77mm x 32.26mm Outside Dim

Viewing Area (width)

53.8mm

Height

32.26mm

Length

4.75mm

Width

64.77mm

Viewing Area (height)

22.3mm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free