HS-23-C

Murata Power Solutions Inc. HS-23-C

Part No:

HS-23-C

Datasheet:

TMP Models

Package:

Aluminum

ROHS:

AINNX NO:

3059227-HS-23-C

Category:

Accessories

Description:

MURATA POWER SOLUTIONS HS-23-C HEAT SINK

Products specifications
  • Package / Case
    Aluminum
  • Material
    Aluminium
  • Body Material
    Aluminium
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Type
    Passive
  • Color
    Black
  • Depth
    50.8mm
  • Accessory Type
    Heat Sink Kit
  • Height
    12.7mm
  • Length
    76.2mm
  • Width
    50.9mm
  • REACH SVHC
    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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