NCC1206F222GTRF
SOD-80 Variant
39908217-NCC1206F222GTRF
Choke, Common Mode, 2.2 kOhm, 200 mA, 3.2mm x 1.6mm x 2mm
Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.
a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.
In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.