Nisshinbo Micro Devices Inc. NJM2283D

Mounting Type

Through Hole

Package / Case

16-DIP

Supplier Device Package

16-DIP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Applications

Consumer Video

Function

Switch