NXP MSCMMX6QZDK08AB

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

500

Package Description

FBGA,

Package Style

GRID ARRAY, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

MSCMMX6QZDK08AB

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

NXP Semiconductors

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.83

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.31.00.01

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

260

Terminal Pitch

The center distance from one pole to the next.

0.65 mm

Reach Compliance Code

compliant

JESD-30 Code

R-PBGA-B500

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Speed

800 MHz

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

Seated Height-Max

1.8 mm

Boundary Scan

YES

Low Power Mode

YES

Format

FIXED POINT

Integrated Cache

YES

Width

14 mm

Length

17 mm