NXP Semiconductors 74AHC1GU04GW,165

PCB changed

5

ECCN (US)

EAR99

Number of Elements per Chip

1

Logic Family

AHC

Mounting

Surface Mount

Supplier Package

TSSOP

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-40

Propagation Delay Test Condition (pF)

50

Maximum Quiescent Current (uA)

1

Maximum Operating Supply Voltage (V)

5.5

Typical Operating Supply Voltage (V)

5

Minimum Operating Supply Voltage (V)

2

Maximum High Level Output Current (mA)

-8

Maximum Low Level Output Current (mA)

8

Process Technology

CMOS

Absolute Propagation Delay Time (ns)

13.5

Maximum Propagation Delay Time @ Maximum CL (ns)

10.6@3V to 3.6V|[email protected] to 5.5V

Package Width

1.35(Max)

Package Length

2.25(Max)

Package Height

1(Max)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Pin Count

a count of all of the component leads (or pins)

5

Logic Function

Inverter

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant