ECCN (US)
EAR99
HTS
8542.39.00.01
Logic Family
AHC
Number of Elements per Chip
1
Number of Channels per Chip
8
Number of Inputs per Chip
8
Number of Input Enables per Chip
0
Number of Outputs per Chip
8
Number of Output Enables per Chip
2 Low
Bus Hold
No
Maximum Propagation Delay Time @ Maximum CL (ns)
Absolute Propagation Delay Time (ns)
19.5
Process Technology
CMOS
Input Signal Type
Single-Ended
Maximum Low Level Output Current (mA)
8
Maximum High Level Output Current (mA)
-8
Minimum Operating Supply Voltage (V)
2
Typical Operating Supply Voltage (V)
5
Maximum Operating Supply Voltage (V)
5.5
Maximum Quiescent Current (uA)
4
Propagation Delay Test Condition (pF)
50
Maximum Power Dissipation (mW)
500
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
125
Supplier Package
TSSOP
Mounting
Surface Mount
Package Height
0.95(Max)
Package Length
6.6(Max)
Package Width
4.5(Max)
PCB changed
20
Package
Bulk
Base Product Number
74AHC541
Mfr
NXP USA Inc.
Product Status
Active
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Bulk
Series
*
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active
Pin Count
a count of all of the component leads (or pins)
20
Output Type
3-State
Polarity
Non-Inverting
Logic Function
Buffer/Line Driver
RoHS Status
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.
RoHS Compliant