NXP Semiconductors 74HC00D,653

Lead Shape

Gull-wing

ECCN (US)

EAR99

Number of Elements per Chip

4

Logic Family

HC

HTS

8542.39.00.01

Maximum Low Level Output Current (mA)

5.2

Process Technology

CMOS

Absolute Propagation Delay Time (ns)

135

Maximum Propagation Delay Time @ Maximum CL (ns)

25(Typ)@2V|7(Typ)@6V|9(Typ)@4.5V

Number of Element Outputs

1

Number of Selection Inputs per Element

0

Number of Output Enables per Element

0

Number of Element Inputs

2-IN

PCB changed

14

Package Width

4(Max)

Package Length

8.75(Max)

Package Height

1.45(Max)

Mounting

Surface Mount

Supplier Package

SO

Standard Package Name

SOP

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-40

Propagation Delay Test Condition (pF)

50

Maximum Quiescent Current (uA)

40

Maximum Operating Supply Voltage (V)

6

Typical Operating Supply Voltage (V)

5

Minimum Operating Supply Voltage (V)

2

Maximum High Level Output Current (mA)

-5.2

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

14

Logic Function

NAND

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant