NXP Semiconductors BZX585-C2V4

Mount

Surface Mount

Number of Pins

2

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150 °C

Min Operating Temperature

-65 °C

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

300 mW

Impedance

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

100 Ω

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Current

1 A

Max Reverse Leakage Current

50 µA

Test Current

5 mA

Zener Voltage

2.4 V

Height

650 µm

Length

1.25 mm

Width

850 µm

REACH SVHC

No SVHC