NXP Semiconductors NX2301P,215

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Supplier Device Package

TO-236AB

Mfr

NXP Semiconductors

Current - Continuous Drain (Id) @ 25℃

2A (Ta)

Drive Voltage (Max Rds On, Min Rds On)

1.8V, 4.5V

Power Dissipation (Max)

400mW (Ta), 2.8W (Tc)

Qualification

AEC-Q101

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

150°C (TJ)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

FET Type

P-Channel

Rds On (Max) @ Id, Vgs

120mOhm @ 1A, 4.5V

Vgs(th) (Max) @ Id

1.1V @ 250µA

Input Capacitance (Ciss) (Max) @ Vds

380 pF @ 6 V

Gate Charge (Qg) (Max) @ Vgs

6 nC @ 4.5 V

Drain to Source Voltage (Vdss)

20 V

Vgs (Max)

±8V

Grade

Automotive