NXP Semiconductors PCK2001DL,512

ECCN (US)

EAR99

Fanout

1:18

Number of Outputs per Chip

18

Maximum Propagation Delay Time @ Maximum CL (ns)

2.5(Typ)@3.3V

Absolute Propagation Delay Time (ns)

5

Maximum Duty Cycle (%)

55%

Minimum Operating Supply Voltage (V)

3.135

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.465

Maximum Quiescent Current (mA)

0.1

Maximum Power Dissipation (mW)

850

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Standard Package Name

SOP

Supplier Package

SSOP

Mounting

Surface Mount

Package Height

2.35(Max)

Package Length

16(Max)

Package Width

7.6(Max)

PCB changed

48

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Fanout Buffer

Pin Count

a count of all of the component leads (or pins)

48

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant