NXP Semiconductors PX1011BI-EL1/G

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

81

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

BGA

Package Description

LFBGA,

Manufacturer Package Code

SOT-643-1

Moisture Sensitivity Levels

3

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Nom

1.2 V

JESD-609 Code

e1

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

260

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

30

Pin Count

a count of all of the component leads (or pins)

81

JESD-30 Code

S-PBGA-B81

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Seated Height-Max

1.6 mm

Telecom IC Type

INTERFACE CIRCUIT

Length

9 mm

Width

9 mm