NXP USA Inc. BBY40

Mount

Surface Mount

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

3

Diode Element Material

SILICON

Number of Terminals

3

RoHS

Compliant

Package Description

R-PDSO-G3

Package Style

SMALL OUTLINE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Reflow Temperature-Max (s)

30

Operating Temperature-Max

125 °C

Rohs Code

Yes

Manufacturer Part Number

BBY40

Package Shape

RECTANGULAR

Manufacturer

NXP Semiconductors

Number of Elements

1

Part Life Cycle Code

Active

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

0.71

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape

JESD-609 Code

e3

Pbfree Code

Yes

ECCN Code

EAR99

Terminal Finish

TIN (SN)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

125 °C

Min Operating Temperature

-55 °C

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8541.10.00.70

Subcategory

Varactors

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PDSO-G3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Diode Type

VARIABLE CAPACITANCE DIODE

Forward Current

Current which flows upon application of forward voltage.

20 mA

Max Repetitive Reverse Voltage (Vrrm)

30 V

Rep Pk Reverse Voltage-Max

30 V

JEDEC-95 Code

TO-236AB

Reverse Current-Max

0.01 µA

Breakdown Voltage-Min

30 V

Reverse Test Voltage

28 V

Frequency Band

VERY HIGH FREQUENCY

Diode Capacitance-Nom

29 pF

Diode Cap Tolerance

10.34%

Variable Capacitance Diode Classification

ABRUPT

Diode Capacitance Ratio-Min

5

Width

1.4 mm

Height

1 mm

Length

3 mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No