NXP USA Inc. BFR31,235

Factory Lead Time

8 Weeks

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

1997

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Terminal Finish

Tin (Sn)

Base Part Number

BFR31

Pin Count

a count of all of the component leads (or pins)

3

Power - Max

250mW

FET Type

N-Channel

Input Capacitance (Ciss) (Max) @ Vds

4pF @ 10V

Drain to Source Voltage (Vdss)

25V

FET Technology

JUNCTION

Power Dissipation-Max (Abs)

0.3W

Source Url Status Check Date

2013-06-14 00:00:00

Current - Drain (Idss) @ Vds (Vgs=0)

1mA @ 10V

Voltage - Cutoff (VGS off) @ Id

2.5V @ 0.5nA

Current Drain (Id) - Max

10mA

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant