NXP USA Inc. LPC1112FHN33/102

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

33

Package Description

HVQCCN,

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

1.8 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

LPC1112FHN33/102

Clock Frequency-Max

25 MHz

Package Code

HVQCCN

Package Shape

SQUARE

Manufacturer

NXP Semiconductors

Part Life Cycle Code

Active

Number of I/O Lines

28

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.65

Part Package Code

QFN

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.31.00.01

Technology

CMOS

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Terminal Pitch

The center distance from one pole to the next.

0.65 mm

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

33

JESD-30 Code

S-PQCC-N33

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Speed

50 MHz

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Bit Size

32

Has ADC

YES

DMA Channels

NO

PWM Channels

NO

DAC Channels

NO

Seated Height-Max

1 mm

ROM Programmability

FLASH

Width

7 mm

Length

7 mm