NXP USA Inc. NX20P0407UKZ

Factory Lead Time

14 Weeks

Mounting Type

Surface Mount

Package / Case

12-UFBGA, WLCSP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2017

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Number of Circuits

4

Analog IC - Other Type

POWER SUPPLY SUPPORT CIRCUIT

Voltage - Clamping

28V

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant