NXP USA Inc. TDA18275HN/C1Y

Factory Lead Time

13 Weeks

Mounting Type

Surface Mount

Package / Case

32-VFQFN Exposed Pad

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Not For New Designs

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Type

Silicon Tuner

Applications

TV

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

TDA18275

Pin Count

a count of all of the component leads (or pins)

32

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant