NXP USA Inc. TEA1713T/N1,518

Mounting Type

Surface Mount

Package / Case

24-SOIC (0.295, 7.50mm Width)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2009

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Base Part Number

TEA1713

Pin Count

a count of all of the component leads (or pins)

24

Frequency - Switching

125kHz

Mode

Discontinuous Conduction (DCM)

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant