NXP USA Inc. TEA6851AHN/V205K

Package / Case

32-VFQFN Exposed Pad

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Last Time Buy

Moisture Sensitivity Level (MSL)

3 (168 Hours)