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NXP USA Inc. TEF6635HW/V106ZK
Part No:
TEF6635HW/V106ZK
Manufacturer:
Datasheet:
Package:
100-TQFP Exposed Pad
AINNX NO:
15553-TEF6635HW/V106ZK
Category:
Description:
TUNER DIGITAL 1-CHIP
Products specifications
- Factory Lead Time15 Weeks
- Package / Case100-TQFP Exposed Pad
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
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