ON Semiconductor BCP56-16T1G

Lifecycle Status

ACTIVE (Last Updated: 2 days ago)

Factory Lead Time

8 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mounting Type

Surface Mount

Package / Case

TO-261-4, TO-261AA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

4

Transistor Element Material

SILICON

Collector-Emitter Breakdown Voltage

80V

Number of Elements

1

hFEMin

25

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-65°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Published

2005

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

4

ECCN Code

EAR99

Voltage - Rated DC

80V

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

1.5W

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

1A

Frequency

130MHz

Time@Peak Reflow Temperature-Max (s)

40

Base Part Number

BCP56

Pin Count

a count of all of the component leads (or pins)

4

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

1.5W

Case Connection

COLLECTOR

Transistor Application

AMPLIFIER

Gain Bandwidth Product

The gain–bandwidth product (designated as GBWP, GBW, GBP, or GB) for an amplifier is the product of the amplifier's bandwidth and the gain at which the bandwidth is measured.

130MHz

Polarity/Channel Type

NPN

Transistor Type

NPN

Collector Emitter Voltage (VCEO)

80V

Max Collector Current

1A

DC Current Gain (hFE) (Min) @ Ic, Vce

100 @ 150mA 2V

Current - Collector Cutoff (Max)

100nA ICBO

Vce Saturation (Max) @ Ib, Ic

500mV @ 50mA, 500mA

Transition Frequency

130MHz

Max Breakdown Voltage

80V

Collector Base Voltage (VCBO)

100V

Emitter Base Voltage (VEBO)

5V

Height

1.57mm

Length

6.5mm

Width

3.5mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free