ON Semiconductor MMBFJ177LT1G

Lifecycle Status

ACTIVE (Last Updated: 1 day ago)

Factory Lead Time

8 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

3

Weight

1.437803g

Transistor Element Material

SILICON

Breakdown Voltage / V

30V

Number of Elements

1

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2005

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Voltage - Rated DC

-25V

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

225mW

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

-20mA

Time@Peak Reflow Temperature-Max (s)

40

Base Part Number

MBFJ177

Pin Count

a count of all of the component leads (or pins)

3

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

DEPLETION MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

225mW

FET Type

P-Channel

Transistor Application

CHOPPER

Halogen Free

Halogen Free

Input Capacitance (Ciss) (Max) @ Vds

11pF @ 10V VGS

Drain to Source Voltage (Vdss)

25V

Continuous Drain Current (ID)

20mA

Gate to Source Voltage (Vgs)

25V

FET Technology

JUNCTION

Drain to Source Resistance

300Ohm

Feedback Cap-Max (Crss)

5.5 pF

Current - Drain (Idss) @ Vds (Vgs=0)

1.5mA @ 15V

Voltage - Cutoff (VGS off) @ Id

800mV @ 10nA

Resistance - RDS(On)

300Ohm

Height

1.01mm

Length

3.04mm

Width

1.4mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free