ON Semiconductor MPC860ENZQ50D4

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

357

Clock Frequency-Max

50 MHz

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

Active

Part Package Code

BGA

Risk Rank

5.39

Supply Voltage-Max

3.465 V

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Manufacturer Part Number

MPC860ENZQ50D4

Rohs Code

No

Supply Voltage-Min

3.135 V

Reflow Temperature-Max (s)

30

Supply Voltage-Nom

3.3 V

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

3

Package Style

GRID ARRAY

Package Description

25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

JESD-609 Code

e0

Pbfree Code

No

Terminal Finish

TIN LEAD

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

245

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

357

JESD-30 Code

S-PBGA-B357

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Speed

50 MHz

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR, RISC

Bit Size

32

Seated Height-Max

2.52 mm

Address Bus Width

A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

32

Boundary Scan

YES

Low Power Mode

YES

External Data Bus Width

32

Format

FIXED POINT

Integrated Cache

YES

Length

25 mm

Width

25 mm