ON Semiconductor NUS5530MNR2G

Lifecycle Status

ACTIVE (Last Updated: 5 days ago)

Factory Lead Time

2 Weeks

Mounting Type

Surface Mount

Package / Case

8-VDFN Exposed Pad

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

8

Number of Elements

1

Voltage Rated

RATED voltage is the voltage on the nameplate - the "design point" for maximum power throughput and safe thermal operation.

35V PNP 20V P-Channel

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2006

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

8

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-55°C

Applications

General Purpose

Current Rating (Amps)

2A PNP 3.9A P-Channel

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

2.5W

Peak Reflow Temperature (Cel)

260

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

3.9A

Time@Peak Reflow Temperature-Max (s)

40

Base Part Number

NUS5530MN

Pin Count

a count of all of the component leads (or pins)

8

Rise Time-Max

55ns

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Dual

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

635mW

Transistor Application

SWITCHING

Halogen Free

Halogen Free

Transistor Type

NPN, P-Channel

Collector Emitter Voltage (VCEO)

35V

Max Collector Current

2A

Continuous Drain Current (ID)

-3.9A

Gate to Source Voltage (Vgs)

-35V

Max Frequency

100MHz

Pulsed Drain Current-Max (IDM)

20A

DS Breakdown Voltage-Min

20V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Collector Base Voltage (VCBO)

-55V

Emitter Base Voltage (VEBO)

-5V

DC Current Gain-Min (hFE)

100

Drain to Source Resistance

200Ohm

VCEsat-Max

0.3 V

Fall Time-Max (tf)

70ns

Height

950μm

Length

3.3mm

Width

3.3mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free