ON Semiconductor SN74LS259DR2

Mounting

Surface Mount

Package Height

1.5(Max)

Package Length

10(Max)

Package Width

4(Max)

PCB changed

16

Lead Shape

Gull-wing

ECCN (US)

EAR99

HTS

8542.39.00.01

Logic Family

LS

Latch Mode

Addressable

Number of Channels per Chip

8

Number of Elements per Chip

1

Number of Inputs per Chip

1

Number of Input Enables per Element

1

Number of Selection Inputs per Element

3

Number of Outputs per Chip

8

Number of Output Enables per Element

0

Bus Hold

No

Set/Reset

Master Reset

Maximum Propagation Delay Time @ Maximum CL (ns)

32@5V

Absolute Propagation Delay Time (ns)

38

Process Technology

Bipolar

Maximum Low Level Output Current (mA)

8

Maximum High Level Output Current (mA)

-0.4

Minimum Operating Supply Voltage (V)

4.75

Typical Operating Supply Voltage (V)

5

Maximum Operating Supply Voltage (V)

5.25

Propagation Delay Test Condition (pF)

15

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

70

Standard Package Name

SOP

Supplier Package

SOIC

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

D-Type

Pin Count

a count of all of the component leads (or pins)

16

Polarity

Non-Inverting

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS non-compliant